Oasis Precision can fabricate components from a wide variety
of ceramic materials listed below.

Ceramics

Alumina
Zirconia
Aluminum Nitride (AlN)
SILICON Nitride (SiN)
Boron Nitride (BN)
Silicon Carbide (SiC)
Macor
Shapel
Steatite
Mullite & Cordierite

Glass

Fused Quartz
Fused Silica
Sapphire
ULE / Zerodure (low CTE glasses)
Silicon
BK7 (optical glass)
Borosilicate
Germanium

Isostatic Pressing is a ceramic powder forming process that applies equal pressure in all directions on a powder compact thus achieving maximum uniformity of density and microstructure without the geometrical limitations of uniaxial pressing.

Isostatic pressing is performed "cold" or "hot." Cold isostatic pressing (CIP) is used to compact green parts at ambient temperatures, while Hot Isostatic Pressing (HIP) is used to fully consolidate parts at elevated temperatures by solid-state diffusion.

HIP can also be used to eliminate residual porosity from an already sintered part. At Oasis Precision, we have trusted partners to accommodate our customers HIP needs.

The machining of a ceramic in the unfired state is called green machining. Green machining of ceramics is done whenever possible as a method of attaining closer near net dimensions thus reducing the amount of post fired/diamond grinding costs.

The machining centers used are very similar to those found in standard machine shops, CNC mills and CNC lathes drilling equipment, cut-off saws, surface grinders, rotary grinders, along with some specialty machines designed for very specific functions. Due to the extremely abrasive nature of ceramics, they can only be green machined efficiently using carbide and PCD tools and abrasive wheels.

Parameters such as feed rate, chucking/gripping loads, lathe speeds, removal rates, etc., are substantially different for green ceramics compared to those for metals or fired ceramics. The softer nature of green ceramics dictates a delicate approach, precise set-up and machine to maintain accuracy due to the relatively low elastic modulus of the green ceramic.

Sintering is a thermal treatment for bonding particles into a coherent solid structure via mass transport events that often occur on the atomic scale. Sintering is a heat treatment applied to a powder compact in order to impart strength, integrity and densification.
The temperature used for sintering is below the melting point of the major constituent of the ceramic powder material.
After compaction, neighboring powder particles are held together by cold welds, which give the compact sufficient “green strength” to be handled.
At sintering temperature, diffusion processes cause necks to form and grow at these contact points.

There are two necessary precursors before this “solid state sintering” mechanism can take place:

1. Removal of the pressing lubricant by evaporation and burning of the vapors
2. Reduction of the surface oxides from the powder particles in the compact

These steps and the sintering process itself are generally achieved in a single, continuous furnace by judicious choice, zoning of the furnace atmosphere and appropriate temperature profile throughout the furnace.

Grinding is defined as the removal of material from a part either to reduce it to a suitable size, remove large irregularities from the surface, induce a certain surface finish condition and/or hold a dimensional tolerance tighter than what can be held when firing ceramics that shrink between 15% and 28% during sintering.

Grinding is a process that needs to be factored in speeds, feeds, abrasives being used, and the coolants used to minimize amounts of heat being generated eliminating deep subsurface damage in ceramic and glass materials.

Lapping is a machining process in which two surfaces are rubbed together with an abrasive between them, by hand movement or using either a manual or CNC machine. It is the removal of material to produce a smooth, flat, or unpolished surface. Lapping processes are used to produce dimensionally accurate specimens to high tolerances.

Lapping can be used to obtain a specific surface roughness; it is also used to obtain very accurate surfaces, usually very flat surfaces.

Polishing, a process usually performed after a part has been lapped, is the removal of a very small amount of material to produce a scratch-free, specular surface using fine abrasive particles. Polishing is typically done at very low speeds using either polishing cloths, abrasive films, or specially designed lapping plates.

Our vision is to be the natural choice through valuing our Customer’s needs and delivering high-quality products on-time.

To achieve this, our objective will be the ongoing development of our management processes to continually improve our manufacturing processes by:

• Developing and using key performance indicators
• Continuing to be innovative
• Investing in new technology
• Continually developing the expertise, professionalism and integrity of our people

Oasis Precision Staff